Thermal Management : Highest room-temperature thermal conductivity of any material. The thermal management properties of CVD diamonds deal with today’s single-largest failure in electronics. This single-largest failure is heat.

  • Heat spreaders with 4 levels of thermal conductivity available- 1000-2000 W/mk
  • GaN on diamond wafer substrates are offered with 3x improvement in heat dissipation whilst preserving RF performance
  • It outperforms silicon carbide, copper and aluminum by factors of 3-10

Heyaru’s proficiency guarantees the ease of customer implementation : Heyaru facilitates the customers to integrate its free standing diamond heat spreaders into their systems and modules.

  • Low roughness and very flat models ensuring the ease of attachment and minimized thermal interface resistances
  • Upto 3mm thickness is available
  • Metallization solutions enable die bonding with low thermal barrier resistance, consistent with the industry standard brazing and soldering
  • Free standing diamond available in large areas upto 140mm diameter that can be laser cut to preferred size
  • Extended device lifetimes for a specific power level with increased efficiency and performance
  • Heyaru’s CVD diamond heat spreaders and GaN on diamond wafers

Extended device lifetimes for a given power level and increased performance and efficiency facilitate the next generation of :

  • Optoelectronics Devices
  • Semiconductor Assembly and Test Equipment
  • High Power RF Devices
  • High voltage Power Devices

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