• Thermal Management : Highest room temperature thermal conductivity of any material The thermal management properties of CVD diamonds deal with today’s single largest failure causes in electronics- heat.

    • Heat spreaders with 4 levels of thermal conductivity available- 1000-2000 W/mk

    • GaN on diamond wafer substrates are offered with 3x improvement in heat dissipation whilst preserving RF performance

    • It outperforms silicon carbide, copper and aluminum by factors of 3-10


  • Heyaru’s proficiency guarantees the ease of customer implementation : Heyaru facilitates the customers to integrate its free standing diamond heat spreaders into their systems and modules.

    • Low roughness and very flat models ensuring the ease of attachment and minimized thermal interface resistances

    • Upto 3mm thickness is available

    • Metallization solutions enable die bonding with low thermal barrier resistance, consistent with the industry standard brazing and soldering

    • Free standing diamond available in large areas upto 140mm diameter that can be laser cut to preferred size

    • Extended device lifetimes for a specific power level with increased efficiency and performance

    • Heyaru’s CVD diamond heat spreaders and GaN on diamond wafers


  • Extended device lifetimes for a given power level and increased performance and efficiency facilitate the next generation of :

    • Optoelectronics Devices

    • Semiconductor Assembly and Test Equipment

    • High Power RF Devices

    • High voltage Power Devices



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